I moduli saranno disponibili entro breve con prezzi ancora da definire. Di seguito le caratteristiche tecniche principali:
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All memory chips are verified using overclocking criteria for better quality.
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High quality 6 layers PCB (Printed Circuit Board)
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Optimized for 64-bit OS (operating system)*
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Backward compatible with DDR3-1600, 1333 and 1066
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Lifetime limited warranty
* 32-bit OS environment has 4GB memory addressing barrier which results in 2.5~3GB memory accessibility.
Specifiche:
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2GB/4GB dual channel module kits are tested at 1800MHz
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3GB/6GB triple channel module kits are tested at 1800MHz
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Test at latency settings 8-8-8-24 at 1.65V-1.85V
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SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting
